Title : Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate.

Pub. Date : 2017 Jan 20

PMID : 27941231






3 Functional Relationships(s)
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1 Copper (Cu) films and circuits were fabricated by screen-printing Cu nanoink on low-Tg (glass transition temperature) flexible plastic substrates (PEN and PET) instead of widely used high-Tg polyimide (PI) substrate. Copper proprotein convertase subtilisin/kexin type 1 inhibitor Homo sapiens
2 Copper (Cu) films and circuits were fabricated by screen-printing Cu nanoink on low-Tg (glass transition temperature) flexible plastic substrates (PEN and PET) instead of widely used high-Tg polyimide (PI) substrate. Copper proprotein convertase subtilisin/kexin type 1 inhibitor Homo sapiens
3 The sintered Cu films exhibited strong adhesion to PEN and PET substrates, with measured adhesion strength of 5B by the ASTM D3359 international standard, whereas the top part of the copper film on the PI substrate was stripped off during the adhesion test. Copper proprotein convertase subtilisin/kexin type 1 inhibitor Homo sapiens