PMID-sentid	Pub_year	Sent_text		comp_official_name	comp_offsetprotein_name	organism	prot_offset
30080390-2	2018	Herein, we developed a facile approach to fabricate high-performance, ultra-stable Cu grid (CuG)-based FTEs by UV lithography-assisted electroless deposition of patterned Cu on flexible polyethylene terephthalate (PET), which is then encapsulated by a thin poly(1-vinyl-3-ethylimidazolium bis(trifluoromethanesulfonyl)imide) (P[VEIM][NTf2]) ionogel layer to improve the mechanical flexibility and stability.	Copper	83-85	nuclear transport factor 2	Homo sapiens	334-338	
30080390-2	2018	Herein, we developed a facile approach to fabricate high-performance, ultra-stable Cu grid (CuG)-based FTEs by UV lithography-assisted electroless deposition of patterned Cu on flexible polyethylene terephthalate (PET), which is then encapsulated by a thin poly(1-vinyl-3-ethylimidazolium bis(trifluoromethanesulfonyl)imide) (P[VEIM][NTf2]) ionogel layer to improve the mechanical flexibility and stability.	Copper	92-94	nuclear transport factor 2	Homo sapiens	334-338	
30080390-4	2018	Introduction of the thin uniform P[VEIM][NTf2] ionogel nanofilm by virtue of the superwettability of the Cu layer endows the electrode with excellent mechanical flexibility and stability.	Copper	105-107	nuclear transport factor 2	Homo sapiens	41-45